Viscom AG
Profile Viscom Headquarters Viscom - Solutions and systems for all the electronics industry's inspection tasks Viscom develops, manufactures and sells high-quality inspection systems. The product portfolio encompasses the complete bandwidth of optical and X-ray inspection operations, especially in the area of electronics assemblies.
- +49 94996-0
- 49 511 94996-900
- info@viscom.com
- Carl-Buderus-Str. 9-15
Hanover, 30455
Germany
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product
Solder Joint Inspection – AOI
S3088 ultra
*Extremely fast AOI camera system.*Scalable, modular camera technology with 3D measuring function.*Greatest inspection depth: reliable inspection of 03015 und fine-pitch components.*Maximum fault coverage - 9 views plus 3D measurement.*Best resolution at angled views.*Height measurement of components.*Extremely high throughput due to FastFlow Handling.*Revolutionary simplicity in AOI operation with vVision.*Fast program generation with vVision/EasyPro.*Reading DataMatrix code, bottom up.
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product
Solder Paste Inspection – SPI
S3088 SPI
*Precise control of all essential 3D features; calibration-free.*Extremely high throughput due to FastFlow Handling.*Integrated height tracking. *Viscom Quality Uplink: process optimization and first-pass yield increase.*Simple process analysis with the Viscom Uplink Analyzer.*Fast program generation. *Print optimization through interlinkage with printer (closed loop).
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product
Camera Module
XM Bond HR
Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.
