Alto Inspection Corp.
THE TREND IN TODAY'S SEMICOUNDUCTOR MANUFACTURIGN IS A CONTINUING MIGRATION OF INSPECTION AND METROLOGY FROM THE LABORATORY TO THE PROCESS FLOOR. THE INDUSTRY IS MOVING TOWARD INTEGRATED METROLOGY (IM) THAT WILL SIGNIFICANTLY IMPROVE PRODUCTION YIELD. AT ALTO, WE EMPHASIZE TOOL PERFORMANCE RELIABILIYT AND THOUGHPUT, WE ALSO OFFER THE TOOL FLESXIBILTY AND UPGRADEABILITY THAT IS PERFECT FOR MULTI DEVICES INSPECTION NEEDED IN THE EMERGING MARKET AND IC FOUNDRIES. WE HAVE MAJOR INTEGRATED METROLOGY AND INSPECITON LINES: WAFER SURFACT DEFECT, WAFER THICKNESS, TTV AND FILM THICKNESS MEASUREMENTS AND DEFECT INSPECTION. OUR PRICE-COMPETITVE SOLUTIONS ALLOW CUSTOMERS EARLY DEFECTS DETECTION IN THE PRODUCTION PROCESS, DRIVING DOWN COSTS AND PRODUCTION OUTPUT UP.
- +1-408-307-5209
- 1-408-727-2055
- info@altoinspection.com
- 1040 DI GIULIO AVE,
ST 300
SANTA CLARA,, CA 95050
United States
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Products
Applications
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product
Monitroing and Control
THANKS TO OUR ADVANCED DATA ANALYSIS FUNCTION AND EASY-TO-VIEW USER INTERFACE, YOU CAN IMPLEMENT SPC WITH VERY LITTLE EXTRA WORK. OUR MONITORING SOLUTION IS DESIGNED TO IMPROVE THE TRACKING THE DEFECT AND CAN BE EASILY CORRELATED WITH YOUR MANUFACTURING PARAMETERS FOR ROOT-CAUSE ANALYSIS.
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Non-contact Film Thickness Measurement
ALTO-IRT-7000
ALTO-IRT-7000 (IMPEDANCE RESONANCE TECHNOLOGY ) FILM THICKNESS METROLOGY TOOL UTILIZES NON-CONTACT CAPACITIVE AND EDDY CURRENT TECHNOLOGY TO ANALYZE MICRO SECTORS ON COATED SURFACES THAT ARE 1000 TIMES SMALLER THAN ANY COMPARABLE EDDY CURRENT PRODUCTS. BUT MOST IMPORTANTLY, THIS UNIQUE IRT TECHNOLOGY ALLOWS FOR SOPHISTICATED ANALYSES OF THE CONTINUOUS AND DISCRETE FILMS BELOW 50 ANGSTROMS, DRAMATICALLY IMPROVING THE ACCURACY OF QUALITY CONTROL READINGS.
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Wafer Thickness, TTV, Bow and Warpage
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
