Frontier Semiconductor, Inc,
Frontier Semiconductor (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications.
- 408-432-8838
- 408 232 1115
- FSM100@frontiersemi.com
- 165 Topaz St.
Milpitas, CA 95035
United States
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Products
Applications
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product
Stress Hysteresis in vacuum or gas up to 900C
900 Series
Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles.Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature.
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product
Substrate Thickness, Warp, and TTV Measurement
413 Series
Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
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product
Adhesion Tester
ilm adhesion testing of thin films and stacks on substrates for material evaluation.
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product
Local and Lattice Stress Measurement
127 Raman
Local and Lattice Stress Measurement, Die level Topography for in-die and in-device stress and composition control.
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product
Stress Hysteresis Measurement
500 Series
Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in air.Non-Contact Laser Scanning Technology.
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product
Virtual Interface Technology for 3D-IC Metrology
VIT
TSV profile (depth, top & bottom CD, tilt, SWA)-Residue Detection-RST-Copper Nail Height-Bump Height and Cu pillar height-Edge trim profile
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product
Bow and Global Film Stress Measurement
128 Series
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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product
Sheet Resistance, leakage, and CV-IV measurements
Electrical Char
Full line of front end electrical characterization tools: Sheet Resistance, leakage, and CV-IV measurements.
