QES Mechatronic Sdn Bhd
Designing equipment and providing solution to semiconductor, mass storage and general electronic industries.
- +603-5882 6060
- +603-5667 9078
- sales@creden.com
- 9, Jalan U1/19,
Hicom Glenmarie Industrial Park,
Shah Alam,, Selangor 40150
Malaysia
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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product
Vison Inspection System
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
