ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan
- PXI/PXIe
- Deep Learning Accelerators
- VPX, OpenVPX Rugged Platforms
- ADLINK Software
- Intelligent Data Sharing Platform for Business Crtitical Internet of Things (IoT) Applications
- Industrial IoT Gateway
- Industrial Motherboards & SBCs
- GPIB
- ROS 2 Solutions
- PC104 Single Board Computers
- Machine Vision
- Advanced TCA
- Embedded Graphics Solutions
- Industrial Display Systems & Panel PCs
- True Flat Gaming Monitors
- Certified Medical Devices
- Passenger Information Display
- Automotive Computing
- Data Acquisition (DAQ)
- CompactPCI/PlusIO/Serial
- Computer-On Modules
- 5G Edge Servers
- Infotainment Platform & Boards
- HPERC VITA 75 COTS Computers
- Industrial PCs, Fanless Embedded PCs
- Rugged Railway Solutions
- Network Security Appliances
- Motion Control
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product
COM Express
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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COM Express Mini Size Type 10 Module with Intel Atom® E3800 Series SoC or Celeron Processors (formerly Bay Trail)
nanoX-BT
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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COM-HPC
The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of the industrial edge computing market.
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Computer-On-Module
Open Standard Module (OSM)
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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8-Slot 32-bit 6U CompactPCI Backplane
cBP-6108F
- PICMG:2.0 R3.0, 2.1 R2.0, 2.5 R1.0, 2.9 R1.0Note- Dimension:202.5 x 262.05 (mm, WxH, vertical insertion view)- Segment:One- cPCI Bus:32-bit/33MHz- System Slot:Right-hand side; System Slot Rear I/O:P3, P4 and P5 rear I/O with AB-type shroud
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6U CompactPCI Dual 64-bit PMC Slots Carrier Board
cPCI-8602
- Supports two single-size 32,64-bit/33,66 MHz PMC sites in 4HP width- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- PICMG® 2.1 Hot Swap Specification Compliant- 3.3V or 5V V(I/O) for cPCI bus and PMC sites- PLX® PCI-to PCI bridge PCI6154 for PCI bus- Power and HotSwap LED incidators on front panel
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3U CompactPCI 32-Bit Backplanes with Optional Rear I/O
cBP-3208/3206/3204[R]
- PICMG 2.0 CompactPCI Specification Rev. 2.1 compliant- Numbers of slot: 8/6/4 slots (incl. system slot)- Width: cBP-3208R: 36HP (9-slot) cBP-3206R: 28HP (7-slot) cBP-3204R: 20HP (5-slot)- Right one slot is system slot and others are peripheral slots- 10-layer PCB for accurate impedance control and electr
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5-Slot 64-Bit 6U CompactPCI H.110 Bus Backplane
cBP-6405R
- PICMG:2.0 R3.0, 2.1 R2.0, 2.5 R1.0- Dimension (mm, WxH):120.9 x 262.05 (mm, WxH, vertical insertion view)- Segment:One- cPCI Bus:Up to 64-bit/66MHz- System Slot:Right-hand side (upper side for board's horizontal insertion)
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3U CompactPCI Serial M.2/U.2/SATA Storage Carrier
cPCI-A3H20
- 1x NVMe M.2 and 1x NVMe U.2 drive slot- 1x optional SATA 6Gb/s M.2 drive slot shared space with NVMe U.2- Status LEDs on faceplate: drive activity, hot-swap status, user-configurable- Operating temperature: -40°C to +85°C with qualified modules- EN50155 compliant
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3U CompactPCI® Single 64-bit PMC Slot Carrier Board
cPCI-8301
- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- Supports one single-size 32,64-bit/33,66 MHz PMC site in 4HP width- Universal V(I/O) decided by backplane- Comprehensive EMC shielding
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3U CompactPCI® Serial XMC Module Carrier Blade
cPCI-A3XMC
- 3U 4HP CPCI-S.0 peripheral- One XMC slot- Operating temperature: -40°C to 85°C with qualified components
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3U CompactPCI 8-port Serial Communication Module
cPCI-3548
- Supports 32-bit/33MHz CompactPCI bus- 16C550A compatible serial communication controller- Eight RS-232/422/485 asynchronous communications ports with intelligent buffer- 2500 VDC signal to ground isolation voltage- Auto-flow control; change mode by dip switch- Plug-and-play, IRQ & I/O address automatically assigned by PCI BIOS, shared IRQ- Surge protectors; rugged DB-62 connector
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3U CompactPCI Mini PCI, Mini PCIe Carrier Board
cPCI-3W10
- Supports 32bit, 33/66MHz CompactPCI® bus- One SIM card socket- One Mini PCI and one Mini PCIe socket- PICMG® 2.0 R3.0 compliant