Showing results: 331 - 345 of 642 items found.
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EBP-D5E2 -
ADLINK Technology Inc.
*Segment: 1*Slots: 1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 2 PCI™*Support ATX power supplies*Dimension: 331 mm x 84 mm
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HPCI-13S4LU -
ADLINK Technology Inc.
*Segment: 1*Slots: 3 PICMG® CPU, 4 PCI™, 7 ISA*Supports AT, ATX power supplies*Dimensions: 314.7 mm x 259 mm
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HPCI-9S7U -
ADLINK Technology Inc.
*Segment: 1*Slots: 2 PICMG® CPU, 7 PCI™, 1 ISA*Supports AT, ATX power supplies*Dimensions: 213.4 mm x 259.1 mm
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EBP-9E2 -
ADLINK Technology Inc.
*Segment: 1*Slots: 1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 6 PCI™*Support ATX power supplies*Dimension: 328 mm x 206 mm
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WBP-13E8 -
ADLINK Technology Inc.
*Segment: 1*Slots: 1 PICMG® CPU, 1 PCI-E® x16(with x8 bandwidth), 2 PCI-E® x4(with x4 bandwidth), 5 PCI-E® x1, 4 PCI®*Support ATX power supplies
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cPCIS-6130R -
ADLINK Technology Inc.
The cPCIS-6130R Series subsystem is designed for Telecom Data Center and Enterprise applications requiring a low profile PICMG 2.0 R3.0 CompactPCI compliant chassis with PICMIG 2.1 R2.0 hot swap support. The chassis is 1U height and standard 19" rack mount width for 6U cPCI cards, has a 2-slot board space, a hot swap backplane, a 64-bit/66MHz cPCI bus, and provides rear I/O for 80mm RTMs.
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EBP-10E5 -
ADLINK Technology Inc.
*Segment: 1*Slots:1 PICMG® CPU, 1 PCI-E® x16, 4 PCI-E® x1, 4 PCI®*Support ATX power supplies*Dimension: 330 mm x 318 mm
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ADLINK Technology Inc.
The PICMG CPCI-S.0 CompactPCI Serial standard, which evolved from the PICMG 2.0 specification, is the fastest, most versatile, most cost-effective open standard for CompactPCI (CPCI). The Serial standard is mechanically and electronically compatible with 3U and 6U euro-cards, defining an interface for high-speed switched fabrics with a star topology. Point-to-point connectors allow up to eight peripherals on one system slot without switches or bridges. Ethernet data transfer can be configured with full mesh topology, which allows up to 1000Base-T connections to all peripheral slots for redundant, safety-critical systems.
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HPCI-19S18A -
ADLINK Technology Inc.
*Segment: 1*Slots: 2 PICMG® CPU, 18 PCI™, 0 ISA*Supports AT, ATX power supplies*Dimensions: 415.3 mm x 264.2 mm
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COM-HPC -
ADLINK Technology Inc.
The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of the industrial edge computing market.
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ADLINK Technology Inc.
One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. Type 7 modules are headless (no graphics), which is why they are also referred to as “Server Level COM Express”.
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cExpress-AR -
ADLINK Technology Inc.
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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cExpress-TL -
ADLINK Technology Inc.
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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cExpress-WL -
ADLINK Technology Inc.
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Express-SL/SLE -
ADLINK Technology Inc.
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.