Showing results: 361 - 375 of 642 items found.
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Express-CF/CFE -
ADLINK Technology Inc.
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Express-TL -
ADLINK Technology Inc.
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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nanoX-BT -
ADLINK Technology Inc.
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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cExpress-BW -
ADLINK Technology Inc.
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Express-BD74 -
ADLINK Technology Inc.
*4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)*Intel® Xeon® D SoC (up to 16 cores)*Two 10G Ethernet and NC-SI support*Up to 32 PCIe lanes (24x Gen3, 8x Gen2)*GbE, two SATA 6 Gb/s, four USB 3.0/2.0*Supports Smart Embedded Management Agent (SEMA®) functions
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aTCA-9400 -
ADLINK Technology Inc.
*4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)*Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding*COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs*2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel*2x 10G to Fabric channels, 2x1G to Base channels
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Express-BD7 -
ADLINK Technology Inc.
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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cExpress-SL -
ADLINK Technology Inc.
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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ETX® -
ADLINK Technology Inc.
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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ADLINK Technology Inc.
The COM Express Type 10 Mini (84 x 55 mm, credit card size) module is intended for low power platforms (TDP 12W and below), capable of entry level processing with ultra-low power consumption, while supporting graphics and optimized I/O count for mobile applications. Type 10 modules are targeted at handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications.
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Express-CFR -
ADLINK Technology Inc.
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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miniBASE-10R -
ADLINK Technology Inc.
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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ADLINK Technology Inc.
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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Express-BASE -
ADLINK Technology Inc.
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Express-ADP -
ADLINK Technology Inc.
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.