ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan
- PXI/PXIe
- Deep Learning Accelerators
- VPX, OpenVPX Rugged Platforms
- ADLINK Software
- Intelligent Data Sharing Platform for Business Crtitical Internet of Things (IoT) Applications
- Industrial IoT Gateway
- Industrial Motherboards & SBCs
- GPIB
- ROS 2 Solutions
- PC104 Single Board Computers
- Machine Vision
- Advanced TCA
- Embedded Graphics Solutions
- Industrial Display Systems & Panel PCs
- True Flat Gaming Monitors
- Certified Medical Devices
- Passenger Information Display
- Automotive Computing
- Data Acquisition (DAQ)
- CompactPCI/PlusIO/Serial
- Computer-On Modules
- 5G Edge Servers
- Infotainment Platform & Boards
- HPERC VITA 75 COTS Computers
- Industrial PCs, Fanless Embedded PCs
- Rugged Railway Solutions
- Network Security Appliances
- Motion Control
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COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Rugged SOSA-Aligned 3U VPX NVIDIA GPGPU Blade
VPX3-MXM-RTX5000
The VPX3-MXM/RTX5000 is a 3U VPX general-purpose GPU (GPGPU) blade based on the NVIDIA RTX5000, supporting 16GB GDDR6 graphics memory with 4x DisplayPort or 4x HDMI output. The VPX3-MXM/RTX5000 brings a new level of performance to visual graphics and computing applications, fully integrating hardware acceleration for both graphics and computing code, enabling hardware acceleration for a wider class of applications than ever before.
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6U VPX Dual Nodes Blade With Intel® Xeon® W-11865MRE
VPX6200
- Dual nodes, redundancy architecture- Intel® Xeon® W-11865MRE processor (formerly Tiger Lake-H) per node- M.2 2242 slot per node (upgradeable to 1TB by option)- VITA 46/48/65 compliant for quick deployment- Supports Windows 10 IoT Enterprise LTSC 21H2 and Linux (kernel 5.13 and higher)
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Open Frame Panel PC
By highly flexible configuration with a high level of modularization, ADLINK's Open Frame Panel PC, leveraging Intel® x86 and NXP ARM-Based solutions, with ready-to-use design helps system integrators, integrated solution providers, and brand vendors quickly deliver cutting-edge functions to individual HMI applications. Leveraging our unique Function Module (FM) design, these industrial panel PCs accelerate prototyping according to the application's requirements while saving considerable time, money, and effort. The SP2 series is ideal for industrial automation, transportation, retail, healthcare, gaming, and other industries.
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3U VPX Development Kit
This development kit enables efficient 3U VPX backplane design and software verification.- 3U VPX architecture- One CPU blade, one GPU blade (optional), SOSA-aligned- 1TB NVMe pre-installed in CPU blade- Rear transition module(s) included- Test Frame with backplane pre-installed
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COM Express Type 6 Prototyping Kit Based On Intel® 12th Gen Core™ I5-12600HE
COM Express Type 6 Alder Lake-P
The COM Express Type 6 Alder Lake-P is a powerful COM Express Type 6-based IoT solution development kit powered by Intel 12th Gen i5-12600HE 12-core (4 P-core + 8 E-core) SoC with integrated Intel Iris Xe GPU graphics (80 execution units) and comprehensive high speed interfaces.
Parent
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Chroma Group
The focal points of Chroma are tests and measurements on power electronics, passive components, electrical safety, video & color, LCD/LCM, automotive electronics, and semiconductor industries. More importantly, Chroma also drives itself toward clean technology by providing testing solutions in photovoltaic, LED, Li-battery, power battery pack, electric vehicles and other emerging new eco-industries. After sustained investment and expansion for nearly 30 years, the operation of Chroma Group has covered most of the precision tests and measurements for various professional fields to provide turnkey test and automation solutions, also stridden across the areas of semiconductor materials, LED Chip & semiconductor inspection service, industrial PC, commercial LED/LCD monitor, electric scooter and electric vehicle powertrain system. Rooted in Taiwan with global arrangement, Chroma Group has setup operations in America, Europe, Mainland China and East Asia along with dealers all over the major cities in the world to provide convenient and fast services for customers everywhere.
Siblings
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Chroma ATE Inc.
Founded in 1984, Chroma ATE Inc. is a world leading supplier of precision test and measurement instrumentation, automated test systems, intelligent manufacturing systems, and test & automation turnkey solutions marketed globally under the brand name "Chroma". Significant markets served by Chroma include semiconductors, photonics, LED, photovoltaics, video & color, flat panel displays, power electronics, passive components, electrical safety, green batteries, electric vehicles, thermoelectrics, automated optical inspection and intelligent manufacturing systems for ICT and cleantech industries.
Siblings
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Chroma Systems Solutions, Inc.
From power conversion to battery to electrical safety, our test systems will maximize your time, improve your validation process, increase your throughput and help the world’s leading R&D labs with testing applications as diverse as your requirements.
Siblings
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Adivic RF Test & Measurement
Huihong Technology specializes in RF technology for nearly 20 years. It is a leading manufacturer of RF measurement instruments in Taiwan, providing the required solutions for RF RF recording and playback, semiconductor RF signal testing, and GPS signal simulation.
Siblings
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Camtek Intelligent Imaging
Camtek is a leading developer and manufacturer of high-end inspection inspection and metrology equipment for the semiconductor industry.
Siblings
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Environmental Stress Systems, Inc.
Product line has expanded to provide an array of environmental stress screening products for the commercial, automotive, aerospace and military electronics industries.
Related
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Virginia Panel Corporation
Virginia Panel Corporation (VPC) provides VPC provides Interconnect Solutions that enable simultaneous connection of multiple test and measurement signal types through one modular interface. Designed to accommodate signal, power, RF, thermocouple, pneumatic/vacuum, and fiber optic connector modules in multiple configurations, VPC’s innovative products meet the demands of test & measurement interconnect requirements.
