ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan
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product
I-Pi SMARC Development Kit based on MediaTek® Genio 1200 platform
I-Pi SMARC 1200
The I-Pi SMARC 1200 is a SMARC-based, AI and graphics-centric solution development kit powered by MediaTek® Genio 1200 (Octa-core Arm Cortex-A78 x4 + A55 x4) processor with a 5-core Arm Mali-G57 GPU for advanced 3D graphics and an integrated APU (AI Processor Unit) system delivering up to 5 TOPS.
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COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Ampere Altra Developer Platform
Backed by a broad Arm® ecosystem with an Ampere® Altra® SoC at its core, using the Arm® Neoverse™ N1 platform, the Ampere Altra Developer Platform provides premium performance from a cloud-to-edge infrastructure, keeps an extremely low thermal envelope, lower TCO, and significantly lower power consumption than x86 designs. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
*4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)*Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding*COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs*2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel*2x 10G to Fabric channels, 2x1G to Base channels
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96-CH High-Driving DIO Card
PCI-7396
The PCI-7396 is 96-bit parallel digital input/output (DIO) cards designed for industrial applications. The PCI-7396 emulates four 8255 Programmable Peripheral Interface (PPI) chips. Each PPI offers three 8-bit DIO ports which can be accessed simultaneously. The total 12/6 ports can be configured as input or output independently.
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Embedded Graphics Solutions
Designed to support the heavy technological demand of industrial applications, ADLINK’s embedded GPU solutions incorporate the latest NVIDIA GPU technology to take graphics processing to the next level. ADLINK’s GPUs allow for accelerated rendering, AI inferencing, graphics, and computing performance, all while reducing I/O latency and improving system responsiveness. ADLINK also takes common industrial concerns into consideration, with its embedded MXM GPUs that address size, weight, and power constraints and professional PCI express graphics cards that enhance graphics quality and support high-performance computing applications. Importantly, ADLINK’s embedded GPU solutions are durable and long-lived, able to respond to the demanding needs of the healthcare, manufacturing, logistics, transportation, aerospace, telecommunications, and defense industries over a long period.
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32-CH 80 MB/s High-Speed Digital I/O Card
PCIe-7300A
ADLINK PCIe-7300A is an ultra-high-speed digital I/O card. It consists of 32 digital input/output channels. High performance designs and state-of-the-art technology make this card ideal for a wide range of applications, such as high-speed data transfer, digital pattern generation and digital pattern capture applications, and logic analyzer applications. Trigger signals are available to start the data acquisition of pattern generation.
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96-CH 12-Bit 3 MS/s Ultra High Density Analog Input PXI Module
PXI-2208
ADLINIK PXI-2208 is an ultra high-density, highperformance analog input module. This device can sample up to 96 AI channels with various gain settings and scan sequences, making it ideal for dealing with ultra high-density analog signals with various input ranges and sampling speeds. These devices also offer a differential mode for 48 AI channels to achieve maximum noise elimination. The PXI-2208 also features analog and digital triggering and 24-CH programmable digital I/O lines. Like all the other members in the PXI-2000 family, the PXI-2208 is able to perform analog input at full speed. Multiple modules can also be synchronized through the PXI trigger bus. The auto-calibration feature adjusts the gain and offset to a specified accuracy, eliminating the need to calibrate the modules by adjusting trimpots.
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SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
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Intel® Wireless-AC 9260 Wi-Fi + Bluetooth M.2 2230 Module Card with Cables and Antenna Kit
EWK-M2-AC9260
- Bluetooth 5.1- IEEE 802.11ac wave 2 (Wi-Fi 5)- Operating Temperature : 0°C to 70°C (-40°C to 75°C extended)- Compact M.2 2230, A/E key form factor with cable and antenna kit to support flexible installation
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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1 PICMG® CPU, 4 PCI™, 1 ISA Slots Backplane
HPCI-D6S4
*Supports AT and ATX power supplies*Slots: 1 PICMG® CPU, 4 PCI™, 1 ISA*Segment: 1*Dimensions: 261 mm x 79.6 mm
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SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GBVersatile storage: SSD, CFast, M.2Dual PMC/XMC sitesRemote management and TPM support
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PXI Embedded Controller
PXI-3982
The ADLINK PXI-3982 PXI embedded controller, based on the 6th generation Intel® Core™ i7 processor, is specifically designed for hybrid PXI based testing systems, delivering a rugged yet stable platform for a wide variety of testing and measurement applications.
Parent
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Chroma Group
The focal points of Chroma are tests and measurements on power electronics, passive components, electrical safety, video & color, LCD/LCM, automotive electronics, and semiconductor industries. More importantly, Chroma also drives itself toward clean technology by providing testing solutions in photovoltaic, LED, Li-battery, power battery pack, electric vehicles and other emerging new eco-industries. After sustained investment and expansion for nearly 30 years, the operation of Chroma Group has covered most of the precision tests and measurements for various professional fields to provide turnkey test and automation solutions, also stridden across the areas of semiconductor materials, LED Chip & semiconductor inspection service, industrial PC, commercial LED/LCD monitor, electric scooter and electric vehicle powertrain system. Rooted in Taiwan with global arrangement, Chroma Group has setup operations in America, Europe, Mainland China and East Asia along with dealers all over the major cities in the world to provide convenient and fast services for customers everywhere.
Siblings
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Chroma ATE Inc.
Founded in 1984, Chroma ATE Inc. is a world leading supplier of precision test and measurement instrumentation, automated test systems, intelligent manufacturing systems, and test & automation turnkey solutions marketed globally under the brand name "Chroma". Significant markets served by Chroma include semiconductors, photonics, LED, photovoltaics, video & color, flat panel displays, power electronics, passive components, electrical safety, green batteries, electric vehicles, thermoelectrics, automated optical inspection and intelligent manufacturing systems for ICT and cleantech industries.
Siblings
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Chroma Systems Solutions, Inc.
From power conversion to battery to electrical safety, our test systems will maximize your time, improve your validation process, increase your throughput and help the world’s leading R&D labs with testing applications as diverse as your requirements.
Siblings
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Adivic RF Test & Measurement
Huihong Technology specializes in RF technology for nearly 20 years. It is a leading manufacturer of RF measurement instruments in Taiwan, providing the required solutions for RF RF recording and playback, semiconductor RF signal testing, and GPS signal simulation.
Siblings
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Camtek Intelligent Imaging
Camtek is a leading developer and manufacturer of high-end inspection inspection and metrology equipment for the semiconductor industry.
Siblings
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Environmental Stress Systems, Inc.
Product line has expanded to provide an array of environmental stress screening products for the commercial, automotive, aerospace and military electronics industries.
Related
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Virginia Panel Corporation
Virginia Panel Corporation (VPC) provides VPC provides Interconnect Solutions that enable simultaneous connection of multiple test and measurement signal types through one modular interface. Designed to accommodate signal, power, RF, thermocouple, pneumatic/vacuum, and fiber optic connector modules in multiple configurations, VPC’s innovative products meet the demands of test & measurement interconnect requirements.
