ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan
- PXI/PXIe
- Deep Learning Accelerators
- VPX, OpenVPX Rugged Platforms
- ADLINK Software
- Intelligent Data Sharing Platform for Business Crtitical Internet of Things (IoT) Applications
- Industrial IoT Gateway
- Industrial Motherboards & SBCs
- GPIB
- ROS 2 Solutions
- PC104 Single Board Computers
- Machine Vision
- Advanced TCA
- Embedded Graphics Solutions
- Industrial Display Systems & Panel PCs
- True Flat Gaming Monitors
- Certified Medical Devices
- Passenger Information Display
- Automotive Computing
- Data Acquisition (DAQ)
- CompactPCI/PlusIO/Serial
- Computer-On Modules
- 5G Edge Servers
- Infotainment Platform & Boards
- HPERC VITA 75 COTS Computers
- Industrial PCs, Fanless Embedded PCs
- Rugged Railway Solutions
- Network Security Appliances
- Motion Control
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COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Ampere Altra Developer Platform
Backed by a broad Arm® ecosystem with an Ampere® Altra® SoC at its core, using the Arm® Neoverse™ N1 platform, the Ampere Altra Developer Platform provides premium performance from a cloud-to-edge infrastructure, keeps an extremely low thermal envelope, lower TCO, and significantly lower power consumption than x86 designs. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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COM-HPC Server Type Ice Lake-D Starter Kit
The COM-HPC Server Type Starter Kit consists of a COM-HPC Server Type module, memory, and thermal solution of your choice with an extended ATX size COM-HPC Server Type reference carrier board, as well as necessary cabling. It allows you to quickly emulate the functionality of your end product for software development and hardware verification. Carrier board design files (schematics, mechanical drawings), COM-HPC module drivers, BSP, and user manual are also offered to aid you in designing your own custom carrier board.
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COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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COM Express® Type 6 R3.1 Reference Carrier Board In ATX Form Factor
Express-BASE6 R3.1
Express-BASE6 R3.1 is an ATX COM-Express Type 6 Basic / Compact size module reference carrier board based on PICMG COM-Express Revision 3.1. Together with the COM-Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for ...show more -
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 ...show more -
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
Parent
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Chroma Group
The focal points of Chroma are tests and measurements on power electronics, passive components, electrical safety, video & color, LCD/LCM, automotive electronics, and semiconductor industries. More importantly, Chroma also drives itself toward clean technology by providing testing solutions in photovoltaic, LED, Li-battery, power battery pack, electric vehicles and other emerging new eco-industries. After sustained investment and expansion for nearly 30 years, the operation of Chroma Group has covered most of the precision tests and measurements for various professional fields to provide turnkey test and automation solutions, also stridden across the areas of semiconductor materials, LED Chip & semiconductor inspection service, industrial PC, commercial LED/LCD monitor, electric scooter and electric vehicle powertrain system. Rooted in Taiwan with global arrangement, Chroma Group has setup operations in America, Europe, Mainland China and East Asia along with dealers all over the major cities in the world to provide convenient and fast services for customers everywhere.
Siblings
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Chroma ATE Inc.
Founded in 1984, Chroma ATE Inc. is a world leading supplier of precision test and measurement instrumentation, automated test systems, intelligent manufacturing systems, and test & automation turnkey solutions marketed globally under the brand name "Chroma". Significant markets served by Chroma include semiconductors, photonics, LED, photovoltaics, video & color, flat panel displays, power electronics, passive components, electrical safety, green batteries, electric vehicles, thermoelectrics, automated optical inspection and intelligent manufacturing systems for ICT and cleantech industries.
Siblings
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Chroma Systems Solutions, Inc.
From power conversion to battery to electrical safety, our test systems will maximize your time, improve your validation process, increase your throughput and help the world’s leading R&D labs with testing applications as diverse as your requirements.
Siblings
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Adivic RF Test & Measurement
Huihong Technology specializes in RF technology for nearly 20 years. It is a leading manufacturer of RF measurement instruments in Taiwan, providing the required solutions for RF RF recording and playback, semiconductor RF signal testing, and GPS signal simulation.
Siblings
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Camtek Intelligent Imaging
Camtek is a leading developer and manufacturer of high-end inspection inspection and metrology equipment for the semiconductor industry.
Siblings
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Environmental Stress Systems, Inc.
Product line has expanded to provide an array of environmental stress screening products for the commercial, automotive, aerospace and military electronics industries.
Related
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Virginia Panel Corporation
Virginia Panel Corporation (VPC) provides VPC provides Interconnect Solutions that enable simultaneous connection of multiple test and measurement signal types through one modular interface. Designed to accommodate signal, power, RF, thermocouple, pneumatic/vacuum, and fiber optic connector modules in multiple configurations, VPC’s innovative products meet the demands of test & measurement interconnect requirements.
