ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan
- PXI/PXIe
- Deep Learning Accelerators
- VPX, OpenVPX Rugged Platforms
- ADLINK Software
- Intelligent Data Sharing Platform for Business Crtitical Internet of Things (IoT) Applications
- Industrial IoT Gateway
- Industrial Motherboards & SBCs
- GPIB
- ROS 2 Solutions
- PC104 Single Board Computers
- Machine Vision
- Advanced TCA
- Embedded Graphics Solutions
- Industrial Display Systems & Panel PCs
- True Flat Gaming Monitors
- Certified Medical Devices
- Passenger Information Display
- Automotive Computing
- Data Acquisition (DAQ)
- CompactPCI/PlusIO/Serial
- Computer-On Modules
- 5G Edge Servers
- Infotainment Platform & Boards
- HPERC VITA 75 COTS Computers
- Industrial PCs, Fanless Embedded PCs
- Rugged Railway Solutions
- Network Security Appliances
- Motion Control
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Industrial-Grade Intelligent Analog & Digital Interface Modular Control Box With Arduino Compatibility
I-Pi OT2IT
Discover the freedom of open-source innovation with ADLINK's industrial-grade I-Pi Arduino-Compatible PLC. Say goodbye to restrictive proprietary systems and embrace the vast, versatile world of the Arduino ecosystem. Accelerate your project's journey from concept to commercialization across diverse automation and control tasks. All this, while ensuring steadfast reliability, professional-grade functionality and industry-ready performance.I-Pi-OT2IT is equipped with numerous analog and digital s...show more -
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SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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I-Pi SMARC Development Kit Based On Intel® 6th Gen Atom® X6425E Quad-Core SoC
I-Pi SMARC Elkhart Lake
The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit powered by Intel Atom x6425E quad-core SoC with integrated Intel UHD graphics and comprehensive high speed interfaces. Development-focused, this kit also supports the latest version of the Intel® Distribution of OpenVINO™ toolkit, which features more deep-learning models, higher inferencing performance, and fewer code changes, making developing ever simpler.
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I-Pi SMARC Development Kit based on MediaTek® Genio 1200 platform
I-Pi SMARC 1200
The I-Pi SMARC 1200 is a SMARC-based, AI and graphics-centric solution development kit powered by MediaTek® Genio 1200 (Octa-core Arm Cortex-A78 x4 + A55 x4) processor with a 5-core Arm Mali-G57 GPU for advanced 3D graphics and an integrated APU (AI Processor Unit) system delivering up to 5 TOPS.
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Qseven® Standard Size Module with Intel Atom® E3900, Pentium® N4200 and Celeron® N3350 Processor (codename: Apollo Lake)
Q7-AL
The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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COM Express Type 7 10GbE SFP+ Network Adapter Card
CEI-2x10G SFP+
- Support up to two 10GbE SFP+ interfaces- Inphi CS4227 inside- COM.0 R3.1 Type 7 compliant- Dedicated for Express-VR7
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COM-HPC Server Type 10G OCP Mezzanine Card
CEI-4x10GBASE-T
- Supports up to four 10GbE copper interface (10GBASE-T)- Compatible with PICMG COM-HPC Rev 1.0 Server Type compliant- For COM-HPC-sIDH module
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COM Express Type 7 10GBASE-T Network Adapter Card
CEI-2x10GBASE-T
- Support up to two 10GbE BASE-T interfaces- Marvell AQR113C inside- COM.0 R3.1 Type 7 compliant- Dedicated for Express-VR7
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COM Express Type 10 Starter Kit Plus
COM Express Type 10 Starter Kit Plus
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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COM Express Type 7 10GbE Optical Fiber Network Adapter Card
10GbE Optical Fiber Network Adapter Card
- Supports up to four 10GbE optical fiber interfaces (SFP+)- Compatible with PICMG COM.0 R3.0 Type 7 modules
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COM Express Type 7 10GBASE-T Network Adapter Card
10GBASE-T Network Adapter Card
- Supports up to four 10GbE copper interface (10GBASE-T)- Compatible with PICMG COM.0 R3.0 Type 7 modules