Showing results: 601 - 615 of 638 items found.
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EOS-i6000-M Series -
ADLINK Technology Inc.
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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LEC-BTS -
ADLINK Technology Inc.
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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I-Pi SMARC Plus -
ADLINK Technology Inc.
The I-Pi SMARC Plus is small (110mm x 110mm) SMARC reference carrier board based on SGeT SMARC (Smart Mobility ARChitecture) 2.1 hardware specification. Together with the SMARC short size module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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HPERC-KBL-MH -
ADLINK Technology Inc.
Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel® Xeon® processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.
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VPX3-TL -
ADLINK Technology Inc.
ADLINK VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11000E Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.
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VPX3010 -
ADLINK Technology Inc.
The VPX3010 Series is a 3U VPX processor blade featuring the Intel® Xeon® Processor D-1500 SoC with up to 12 cores. The VPX3010 provides up to 16GB DDR4-2133 dual channel ECC memory soldered onboard, one PCI Express x8 Gen3 XMC expansion slot with VITA 46.9 rear IO, and onboard soldered 32GB SLC SATA solid state drive. Rear I/O via P1 and P2 includes 2x 10GBASE-KX4, 2x 1000BASE-T (or one 1000BASE-T and two 1000BASE-BX by BOM option), 2x SATA 6 Gb/s, 1x USB 2.0, 2x USB 3.0, 6x GPIO, VGA, 1x RS-232, 1x RS-232/422, and up to PCIe x16 Gen3 supporting non-transparent bridge for peer-to-peer communication (dependent on BOM option).
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VPX3001 -
ADLINK Technology Inc.
The VPX3001 Series is a 3U VPX processor blade featuring the 3rd Generation Intel® Core™ i7 processor with Mobile Intel® QM77 Express Chipset. The VPX3001 provides up to 8GB DDR3-1066/1333 dual channel ECC memory soldered onboard, one PCI Express x8 XMC.3 site with VITA 46.9 rear IO, and onboard soldered 32GB SLC SATA solid state drive. Rear I/O via P1 and P2 includes 2x 1000BASE-T or 2x 1000BASE-BX (BOM option), 1x SATA 6 Gb/s, 1x SATA 3 Gb/s, 2x USB 2.0, 6x GPIO, VGA, 1x RS-232, and 1x RS-232/422.
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CT-6530 -
ADLINK Technology Inc.
The CT-6530 is a rugged conduction cooled 6U CompactPCIR processor blade in single-slot (4HP) width form factor featuring enhanced graphics, computing power, energy efficiency, system manageability and data security provided by the 4th generation IntelR Core? i7/i5 processor (4C/2C), and soldered DDR3L-1600 ECC memory up to 8GB. The CT-6530 supports -40ºC to +85ºC operating temperature range at wedge locks, offers outstanding performance and is an ideal solution for mission-critical defense and aviation applications.
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VPX3020 -
ADLINK Technology Inc.
*Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)*DDR4-2666 soldered ECC SDRAM up to 16GB*Optional SATA SLC SSD, up to 64GB*Up to PCIe x16 Gen3 interface supporting non-transparent bridge
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CT-3620 -
ADLINK Technology Inc.
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
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CT-3510 -
ADLINK Technology Inc.
The ADLINK CT-3510 Series is a rugged conduction cooled 3U CompactPCI® PlusIO compatible processor blade in single-slot (4HP) with soldered DDR3L-1600 ECC memory up to 8GB. The ADLINK CT-3510 features an Intel® Core™ i7 processor with Mobile Intel® QM87 Express Chipset.
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RK-609B -
ADLINK Technology Inc.
- Supports 10 slot PICMG backplane- Two 5.25" and two 3.5" external drive bays, one internal 3.5" drive bay- Upper cover with captive screw- Drive bay with shock and vibration resistant design- Replaceable and easy-to-clean air filter- 12cm cooling fan (85CFM)- Two USB and one PS/2 keyboard connectors on front panel
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RK-608MB-C / IMB-M40H -
ADLINK Technology Inc.
ADLINK's rackmount and wallmount industrial chassis are aligned with integrated subsystem design, service and performance, is optimized for combined motion/vision/IO applications.
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Q7-BASE -
ADLINK Technology Inc.
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
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ND-6060 -
ADLINK Technology Inc.
ADLINK's NuDAM data acquisition modules make up a total acquisition network and control system. Up to 256 NuDAM modules an be romotely controlled on any RS-485 network from a host computer, via a single serial RS-232, allowing communication from as far as 4000 feet from the host. Based on the RS-485 multi-drop network system, each module has a unique address ID, whereby simple ASCII command & response protocols through the standard RS-485 interface can control all the NuDAM modules in the RS-485 network. The NuDAM modules provide direct communications with a wide variety of sensors, perform all signal conditioning, scaling, linearization and conversion, and can acquire measurements of temperature, pressure, flow, voltage, current, and multiple digital signal types.