ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan
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product
High Definition Audio Daughter Board with Line-in, Line-out and Mic-in
DB-Audio2
*Realtek ALC262 High Definition Audio codec*Three jacks: line-in, line-out and mic-in*5x2 pin header for cable connection to external audio header on SBC*4-pin header interface for CD audio output
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High Speed Link Extension Module
HSL-Terminator
The HSL-Terminator can be used for stable communication. The HSLTerminator provides an adjustable resistor to allow the impedance of the wiring of the HSL system or Motionnet system to be adjusted to ensure the quality of the transmission.
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2 PICMG® CPU, 4 PCI™, 3 ISA Slots Backplane
HPCI-8S4
*Supports AT, ATX power supplies*Slots: 2 PICMG® CPU, 4 PCI™, 3 ISA*Segment: 1*Dimensions: 264.2 mm x 218 mm
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SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors (formerly codename: Elkhart Lake)
LEC-EL
The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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I-Pi SMARC Development Kit based on Qualcomm® Robotics RB5 Platform
I-Pi SMARC RB5
The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit harnessing ADLINK LEC-RB5, powered by the Qualcomm® QRB5165 SoC with Qualcomm® Kyro™ 585 octa-core CPU (8x Arm Cortex-A77), and Qualcomm® AI Engine.
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Dual Intel® Xeon® E5-2600 v3 Family 40G Ethernet AdvancedTCA® Processor Blade
aTCA-9710
*Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)*16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256 GB*Intel® C612 PCH*Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels*Support Intel® DPDK and Node Manager 3.0
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SMARC Module
LEC-MTK-I1200
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Distributed 4-Axis Motion Control Modules (with High-Speed Trigger Function)
MNET-4XMO-(C)
The MNET-4XMO is a 4-axis motion controller module for Motionnet distributed motion systems. It can generate fast frequency pulses (9.9 MHz) to drive stepper or servomotors in the machine automation field. As a motion controller, it can provide comprehensive motion functions which include 2 axis circular interpolation, 2-4 axis linear interpolation, or continuous interpolation for continual velocity and so on. Also, changing position/speed on the fly is available with a single axis operation.
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3U CompactPCI 4th/5th Generation Intel® Core™ i7 Processor Blade with ECC
cPCI-3510(BL) Series
The ADLINK cPCI-3510(BL) Series is a 3U CompactPCI processor blade with soldered DDR3L memory up to 16GB. The ADLINK cPCI-3510 features a 4th generation Intel® Core™ i7 processor with Mobile Intel® QM87 Express Chipset. In addition, the cPCI-3510BL SKUs support the 5th generation Intel® Core™ i7 processor (cPCI-3510BL/3510BLD/3510BLG).
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PCIe-to-MXM adapter supporting ADLINK Mobile PCI Express Modules with NVIDIA® Quadro® embedded GPUs
EGX-MXM-AD
The EGX-MXM-AD is an PCIe adapter supporting ADLINK NVIDIA® Quadro® MXM 3.1 Type A, Type B, and Type B+ GPU modules for quick validation and early development purposes on your AI applications. The following modules are supported: EGX-MXM-P1000, EGX-MXM-P2000, EGX-MXM-T1000, EGX-MXM-RTX3000, and EGX-MXM-RTX5000. A reference thermal solution is available.
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Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™
DLAP-401-Xavier
- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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COM-HPC Server Type Reference Carrier Board in Extended ATX Form Factor
COM-HPC Server Base
The COM-HPC Server Base is an extended ATX size COM-HPC Server Type reference carrier board based on PICMG COM-HPC Revision 1.0. Together with the COM-HPC Server Type module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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3U CompactPCI 6-Slot Cubic Chassis with CompactPCI Power Module
cPCIS-2500 Series
The cPCIS-2500 series 3U CompactPCI 6-slot Cubic Chassis is designed for 3U CompactPCI cards and modules without rear I/O. It is 4U in height, 237 mm deep, and suitable for bench top use or wall mounting. It is ideal for industrial or transport applications where small chassis size and versatility are important. A built in cooling system with removable filter provides maximum cooling efficiency, and the 250W cPCI power supply allows easy maintenance. The cPCIS-2500 series' ability to handle a wide range of temperatures and excellent shock and vibration characteristics make it suitable for operating in a rigorous environment.
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4-CH 10/12-Bit 20 MS/s Simultaneous-Sampling Analog Input Cards
PCI-9812
ADLINK’s PCI-9812 and PCI-9810 are 4-CH, 10 or 12-bit, 20 MS/s simultaneous-sampling analog input cards. The high-speed analog input channels are single-ended, with hardware programmable input ranges of ±1 V, ±5 V and input impedances of 50 Ω, 1.25 k Ω and 15 M Ω. The onboard 32 k-sample A/D FIFO can buffer so data throughput is less than 100 Mbytes/s, the FIFO performs as the temporary A/D sample buffer, and as a rule of thumb, no data loss will occur. When four channels operate at 20 MS/s simultaneously, each sample generates two bytes, resulting in 160 Mbyes/s (4 channels * 20 M * 2 bytes) throughput, which exceeds the peak 132 Mbyte/s bandwidth of PCI bus. To avoid data loss, the 32 k-sample FIFO is the limitation of sample count. In addition to the onboard 40 MHz time base, users are able to supply the external time base in either sine wave or digital forms. The PCI-9810 and PCI-9812 also feature external digital trigger and programmable analog trigger, thus the conversion start point of multiple cards can be synchronized to external events. The trigger modes include software-trigger, pre-trigger, post-trigger, middle-trigger and delay trigger, further expands the capabilities of these high-speed devices. ADLINK"s PCI-9812 and PCI-9810 deliver cost-effective and reliable data acquisition capabilities and are ideal for vibration testing, image digitizing, ultrasonic measurement, biomedical research, ATE and other high-end industrial, scientific, and military applications.