ARC Technologies
At ARC, we provide, develop, and manufacture extremely high technology parts, critical components, tooling and subsystems. ARC has a state-of-the-art manufacturing facility with capabilities spanning from precision machining to wafer scale fabrication, thin films, advanced packaging, flip chip hybridization, to electronics and instrumentation.
- 651-789-9000
- info@arcnano.com
- 4459 White Bear Parkway
White Bear Lake, MN 55110
United States
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Apertures
ARC possesses the machining techniques, skill and equipment to fabricate a wide variety of apertures in a similarly wide variety of materials. The aspect ratio of aperture opening to material thickness is generally limited to a 1:20 ratio. Shown on the right in Figure 1 is an aperture with a wide series of holes ranging from 15um to 960um.
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X-ray Windows
X-ray devices have become ubiquitous in the marketplace. The X-ray device market is divided into Portable and Stationary product types. The Market is also divided by technologies like Analog, Computed Radiography (CR) and Digital Radiography (DR). The Digital Radiography market is further segmented into Flat Panel Detectors (FPD) and High Density Line Scan Solid State Detector. The applications include at a minimum; Medical, Non-Destructive Testing, and Security Detection has driven the rapid spread of X-ray instruments including a myriad of handheld devices.
