Toray Engineering Co., Ltd.
Since our establishment in 1960, we have received an outstanding reputation and trust from our domestic and overseas customers by providing optimal technologies and services to meet their diverse needs in a wide variety of business fields while working on the construction of manufacturing facilities of Toray Industries. We were deeply gratified that the high value and confidence placed in our products by our customers allowed Toray Engineering last year to celebrate its 50th anniversary.
- +82-31-622-0060
- Room 512, Amigo Tower, 358-2, Yatap-Dong, Bundang-Gu, Seongnam-Si,,
Gyeonggi-Do, 463-070,
Korea
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product
Foreign Matter Inspection Device For FPDs
HS-930
By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
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Surface Profiler Measurement System
SP series
SP series, high accuracy 3D surface profiler measurement system with white light interferometry.
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Blemish Checker For FPD
NM Series
Detecting failures and uneven points on color resist film coated by Toray’s Coater. Toray’s customized algorithm achieved fast throughput and high resolution.
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Chip Inspection System
GEN3000T
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Review System
RV-3000
Reduces surface inspection device review time and contributes to greater inspection efficiency! This system uses address information for defects detected by surface inspection equipment to acquire images of defects with a high level of magnification, and categorizes defect types.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Luminescence Defect Inspection System
INSPECTRA® PL Series
This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Measuring & Analysis Equipment
Quality management for semiconductor manufacturing processes and liquid crystal panel manufacturing processes, which require nano-order precision. Oxygen analyzers used in firing furnaces and N2 reflow ovens.Water quality meters used to monitor the water quality of plant discharge and the pure water used in semiconductor manufacturing processes.Our measuring and analysis equipment is used in a wide range of fields.
