Marantz Electronic Ltd.
Mek (Marantz Electronics) is an industry leader in Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI) solutions. With over 8000 AOI machines in use worldwide, our 24-bit imaging technology is driving powerful process control and maximum production yield for Mek electronics assembly and microelectronics customers everywhere.
- +31 40 71 14 111
- info@mek-europe.com
- Polluxstraat 2b
Tilburg, 5047RB,
Netherlands
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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THT AOI
Mek THT AOI overcomes these challenges of automated through-hole inspection with a unique combination of mechanical, optical and software design alternatives, unavailable in many conventional systems.
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Bottom-up and Top-down 3D Modular AOI
SpectorBOX
With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
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Mek Selective 3D AOI
Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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Entry Level AOI
iSpector
The Mek iSpector series AOI machines are fully compatible with Mek’s Catch System for classification, repair and SPC, utilizing the same powerful 22X software that is used in the premier Mek PowerSpector series. There is no compromise on the wide range of inspection algorithms and component libraries.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
