For the generation of unique bond links the use of high-quality components is an essential precondition. Despite all care in the production of ultrasonic transducers again and again unexpected effects occur, which only manifest themselves in the use of those transducers and which also have the reason in the transducer itself.
The optical displacement measurement systems of the ODS series are specially designed for measuring the ultrasonic vibration displacement at bond tools of wire & flip-chip die bonders. The systems are highly accurate and very easy to use. That makes it the perfect tool for displacement based calibration of ultrasonic bond machines.
F&K Physiktechnik develops and manufactures fully digital ultrasonic generators. Ultrasonic power levels are available for fine wire bonding as well as for heavy wire and die bonding applications. All generators could be used with our ultrasonic transducers, but also with third party transducers.
F&K Physiktechnik offers ultrasonic transducers "Made in Germany" for all kinds of bond applications. The complete range includes fine wire wedge transducers, fine wire ball transducers as well as heavy wire transducers.