Test Research, Inc.
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.
- +886 2 28328918 Ext. 0
- +886 2 28320598
- sales@tri.com.tw
- 7F., No.45, Dexing W. Rd
Shilin Dist
Taipei City, 11158
Taiwan
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product
Automated Optical Inspection (AOI)
TR7700 SIII
TR7700 SIII is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII offers a powerful and easy to use AOI solution with fast programming, optimized board loading, production line integration and support for offline programming. TRI's new color algorithm combined with multiple lighting phases increase defect coverage and help deliver highly accurate inspection results with a minimum of false calls.
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product
Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Conformal Coating Inspection (CI AOI)
They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Automated X-ray Inspection (AXI)
Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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Semiconductor Inspection (SEMI)
A process for detecting any particles or defects in a wafer.
