Rhesca Co., Ltd.
Manufactures and sells strength testers that measure solder joint strength and bonding strength in the semiconductor assembly process, and surface property testers that evaluate thin film adhesion and frictional wear.
- +81-(0)42-582-4711
- +81-(0)42-589-4686
- 1-15-17 Hinohonmachi
Hino City
Tokyo Prefecture, 191-0011
Japan
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product
Tackiness Tester
TAC1000
For the measurement of tackiness (instantaneous adhesive strength) of various pastes and adhesive tapes, it is possible to quantitatively evaluate the data, which until now had large errors due to individual differences. First, press the measuring probe, which is controlled (approach speed, pressure force, pressure time, separation speed) against the sample, and measure the adhesive force in the process of separating. Measured data can be processed by a computer. With double temperature control (patented), the sample piece is preheated from the back side with a hot plate and the heated probe penetrates the measurement surface, making it possible to keep the set temperature and the temperature of the test surface to be evaluated constant. Since the pressurization time can be as short as 10msec, it is possible to measure the tackiness caused by momentary contact.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Thermal Conductivity Measuring Device
TCM1001
In recent years, there has been a demand for small and thin electronic products such as mobile devices, and printed circuit boards are shifting to thin, multi-layered, and even modularized printed circuit boards. effect of bonding materials, that is, the ability to easily conduct heat, is emphasized, and testing equipment that evaluates thermal conductivity is required .As a business of our company, we have mainly manufactured and sold test equipment for solder wettability tests and solder bonding strength, but there was a need to urgently develop next-generation bonding material test equipment to replace these. Under these circumstances, we received a request from an academic research facility to manufacture a device that can measure the thermal conductivity of conductive adhesives under research and development, and we were able to obtain an opportunity to develop the device. We proceeded with the development based on these requirements .
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Friction Player
FPR2200
The friction coefficient is measured by the pin-on-disk method. Also, by measuring the coefficient of dynamic friction, surface destruction occurs due to wear and changes in the coefficient of dynamic friction occur .This machine is the latest model that was created by realizing various measurement modes, improving data resolution, and pursuing ease of use based on the achievements cultivated in the friction and wear tester that we have manufactured and sold in the past.
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Scratch Tester
CSR1000
This tester is highly effective in measuring the adhesion strength (adhesion strength) of hard coatings (Ti, TiN, SiC, DLC, etc.) formed by PVD and CVD on metal surfaces such as cemented carbide. Adopting a scratch test method that allows quantitative measurement with simple operations, the film surface is scratched while increasing the load on the sample surface, detecting film breakage with high sensitivity, and providing the load at which film breakage occurs (critical load). tools and mold tools that require
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Ultra Thin Film Scratch Tester
CSR5100
The micro-scratch method (JIS R-3255), which is an evolution of the scratch method that evaluates the adhesion strength between the thin film formed on the material surface and the base material, enables the detection of peeling of thin films. detection, we have a highly sensitive destruction detection mechanism based on our own patented technology (Patent No. 5070146) to evaluate the adhesion strength of ultra-thin
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Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Hot Dipping Simulator
HDPS
This is a hot-dip galvanizing simulator that simulates various hot-dip galvanizing processes such as heating, cooling, vacuuming, gas replacement, and spraying of steel sheets on a laboratory scale. It is possible to simulate the parameters close to the actual line, such as zinc bath temperature, immersion speed, immersion time, and gas flow rate adjustment for weight control. Also, 20 to 25 sheets can be tested
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Dynamic Wettability Tester
6200TN
This is a dynamic wettability tester that uses a high-performance electronic balance to evaluate temporal changes in buoyancy and wetting (contact angle) that are successively received when various solid pieces and powder samples are immersed in liquid. Information such as dynamic and static contact angles, surface tension, and density can be obtained, and it supports various sample forms such as flat plates, fibers, and powders
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Repeat Durability Tester
TIQ1000
It is a device to measure repeated endurance such as limit bending test of board, endurance test of mounted board, endurance test of connector, etc. Continuity data and load data can be obtained during the cyclic endurance test. Conforms to JEITA ET-7407 "Environmental and durability test methods for mounted CSP/BGA packages".
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Hydrophobic Powder Wettability Tester
WET1001
We will introduce a hydrophobic powder wettability tester that measures the critical wetting tension of powder materials such as pharmaceuticals and pigments and considers dispersibility and surface energy. flow rate concentration curve .The amount of organic solvent when this powder lump starts to settle is evaluated as a measure of the degree of affinity (hydrophobicity) with the organic solvent.
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Seam Fold Test Device
FFR1000
This equipment is designed to bend a flexible printed circuit board, which has a high degree of freedom and versatility, and at that time, apply a load to the bending point at the initial stage or each time, and repeat bending and unfolding to confirm the durability.
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High Load Shear Strength Tester
HLST1000
This tester measures the shear force required to analyze the bonding strength of various bonding materials. It is possible to measure shear force up to 5000N for the purpose of bonding strength evaluation over a large area. An optional heating unit enables evaluation while the sample is heated.
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Rolling Displacement Measuring Device
ASR01
This device is used to dynamically measure the displacement and load that occur when a specific sample is pressed down using a flat indenter, and to help analyze the phenomenon and the potential capacity of the sample.
