Advanpack Solutions Pte Ltd.
Advanpack Solutions Pte. Ltd. (APS) provides innovative and integrated flip chip solution to companies that manufacture semiconductors. Our proprietary flip-chip technologies include the Pillar Bump, No-Flow Underfill, fluxes, advanced packaging methods and various proprietary packages including Wafer Level Chip Scale packages.
- (65) 6653 3888
- (65) 6822 6005
- sales@advanpack.com
- 10 Ang Mo Kio Street
65 Techpoint #04-10
Singapore, N/A 569059
Singapore
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Molded Interconnect Subtrate
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
