Arcadia Test
Arcadia Test team members have over 25 years of fixture developing experience. Several of our team members started in bare board test fixture development and have progressed to designing ICT fixtures.
- 408-855-8268
- info@arcadiatest.com
- sales@arcadiatest.com
- 46009 Hotchkiss Street
Fremont, CA 94539
United States
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Test's Wireless Technology
At Arcadia Test, we understand that our Customers need Fixturing Solutions that rival todays technological advances. A fixture technology that met the requirements of the 1990’s, may not provide the necessary features required for todays complex test strategies. We developed our new line of Zion Wireless Test Fixtures with our Customers in mind.
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Dual Stage Fixturing
Arcadia offers various products to accommodate dual stage Fixturing needs. These fixtures allow effortless disconnect of probes from the UUT where needed during ICT. Whether a simple mechanical dual stage is needed, or a complex pneumatic is the solution, we can help. Please call for more information.
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X-Probe Capabilities
The X-Probe kit is a more robust fixture vs. the conventional method of the probe and socket approach. QA Technology developed an interconnect contact probe and probe tube called termination pins, eliminating the use of sockets. With this socketless technology, probes could be mounted to a closer distance to each other.
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Test's Global Services
Arcadia Test provides flexibility to transitioning projects to different parts of the world by offering a strategically placed team and partners to key manufacturing regions such as the Americas, Asia and Europe. This will provide peace of mind, consistency, and a smooth transition whenever you decide to shift to another region.
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Board Stress Analysis
Board stress analysis is an increasingly critical part of the test fixture build process today. Probe densities under BGA devices put tremendous pressure onto the solder joints of these devices. If the fixture is not designed properly, immediate damage can occur to the BGA’s, or even more devastating, future damage, which creates field failures. We can provide strain testing before shipping your fixture to insure that there are not excessive forces placed on your BGA parts. With the use of National Instruments Strain equipment, and tri-directional rosettes, we cycle test the board/fixture and measure and record the amount of strain from each corner of each BGA. Any over limit conditions are corrected before shipment. This service insures that your products will not be damaged at ICT, and help to reduce field failures from damaged components, compromised solder joints, or lifted pads.
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Clamshell Fixtures (Top Side Probing)
Clamshell fixtures are used to test circuit boards from both the top and bottom sides simultaneously. Arcadia offers various assemblies to accommodate this. Whether you require vacuum, pneumatics, or mechanically actuated Z motion lids, we have numerous sizes available from off our shelf inventory to meet every need.
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Finite Element Analysis
This useful tool will minimize induced stress on the board under test. The 3-D software will account for all components populated on the board, and probe force and push rod locations on the fixture. It uses this information to simulate the actual test to determine which area of the board is enduring too much stress and then provide suggestions to correct the situation. A damaged board could cost upwards of thousands of dollars and lost time. Including Board stress analysis in your test strategy is an excellent way to insure that your new test comes up fast, and without any stress related board damage.
