DPA Components International
For over 35 years DPACI has been a key provider of testing and analysis of electronic parts for mission critical systems in the aerospace, space and military industry.
- (805) 581-9200 x250
- (805) 581-9790
- info@dpaci.com
- 2251 Ward Avenue
Simi Valley, CA 93065
United States
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Counterfeit Analysis / Screening Services
DPACI perform counterfeit part analysis on all types of electrical, electronic, and electromechanical (EEE) components. Our suspect counterfeit analysis task groups include source identification, manufacturer validation, external visual inspection, mechanical inspection, electrical test, X-Ray, in-depth internal visual and materials analysis. With one of the largest databases of test reports for EEE components, we can offer similar historical data for correlation with images, test data, certifications and reports.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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QML Memory
DPA Components, International (DPACI) has answered the call by offering our own line of QML Military memory SRAM products.
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Trusted Semiconductor Die/Wafer Source
To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
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EEE Component Testing and Screening Services
DPACI performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability commercial, industrial, space, and U.S. military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications. Our engineering experience in electronic parts screening, qualification, and in-house test fixture fabrication allows us to provide value added components in a timely manner.
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Cryogenics Testing Lab
DPACI Cryogenics Test Laboratory has been operational for over a decade providing test data, temperature cycling, simulation, and analysis for our customer’s rigid deep space component qualification requirements. Our firm provides our customers with most accurate test data taken at temperatures ranging from 10°Kelvin to 400°Kelvin.
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Custom Assembly, Packaging and Qualification
DPACI specializes in providing Turn-Key Solutions. We offer comprehensive manufacturing, assembly, qualification, testing, and certification of high reliability EEE components. We have a dedicated, self-contained Class 10,000 clean room with Class 100 laminar flows certified to QML Q (Military) and V (Space) levels to perform all assembly operations from wafer processing to final hermetic package seal
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Parts Screening And Testing
DPA Components International performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability Commercial, Industrial, Space, and U.S. Military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications.
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RF Testing, Screening and Qualification
DPACI has extensive experience in providing RF testing, screening, as well as QCI services to a diverse range of customers, such as Lockheed Martin, General Dynamics, and Ball Aerospace. We have a fully equipped RF and microwave lab with test capabilities ranging from 40 GHz to 300 GHz for providing RF packaging.
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Patented DPEM Process for Die Removal
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
