Polish Grinders

Tokyo Seimitsu Co., Ltd. (Accretech)

The polish grinder is a single machine that can both slice various device wafers and remove damage,
which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.