Multichamber PECVD/Etch System

Load locked cluster tool
Cassette to cassette processing
Up to 4 coatings can be deposited without breaking vacuum
Substrate sizes: 125 x 125mm,156 x 156mm and
200mm dia. (smaller sizes can be processed
using a carrier)
Typical coatings: SiOx & SiNx - doped & undoped & a- Si
R&D, Pilot production and production capabilities
RIE chambers available
Full computer control
Process chamber is modular and interfaced with 200mm slot valve

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Topics

Systems
Chambers
Carriers
Computer
Loads
Valve