Thickness Measuring Microscope Systems

Thickness Measuring Microscope Systems

The McBain TMS150 and TMS200 uses a unique combination laser displacement sensors, motion control technology and proprietary software to inspect features developed on wafers. This combination of technologies allows simultaneous over/under high-resolution inspection in real time. Recipe driven software assures high throughput while allowing maximum product flexibility and ease of development. Automatic wafer alignment helps to assure maximum repeatability and ease of use.