Camera Module

XM Bond HR - Viscom AG

Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.