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BRIC™ - Large PXI Matrix Modules
High Density Packaging and Integrated BackplanesWith Pickering's BRIC Large PXI Matrix Modules, the use of high density packaging and integrated backplanes enables a large matrix to be implemented with no user configuration or special matrix expansion kits. These matrices use thru-hole mechanical relays (not surface mount) and can be serviced using standard de-soldering tools simplifying repair and reducing down time. Our BRIC's integrated design ensures high matrix performance with high signal bandwidth and fewer system implementation errors.