Lithography
With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
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product
Lithography System
JetStep W2300
The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge.
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product
Lithography System
JetStep S3500
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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product
Lithography System
JetStep G35
The Jetstep G35 system is a high volume manufacturing imaging system for up to Gen 3.5 displays.The JetStep G35 system enables high resolution imaging down to 1.5µm combined with registration and stitching accuracy required by most advanced manufacturing of high resolution displays.
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product
Lithography System
JetStep G45
The JetStep G45 System features <1.5μm resolution capability across a field size diameter of >200mm. Low distortion optics combined with high-speed precision motions enables the system to achieve overlay of <0.5μm.
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product
Lithography System
JetStep X500
The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
