Metrology Systems
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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High Accuracy Dimensional Metrology System
Pinnacle 250
The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring.
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Critical Dimension Measurement System
MicroLine® Series
The MicroLine series of non-contact critical dimensional measurement systems are ideal for semiconductor and MEMS applications. MicroLine systems automatically measure linewidth, overlay, and other critical features on wafers and photomasks. Systems are capable of measuring features from 0.5 m to 400 m in size. Measurement repeatability is 10 nm at 1 s (with 100x objective).
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Compact General-Purpose Metrology System
Benchmark 250
The Benchmark 250 is a compact general-purpose metrology system with all the features and capabilities of the larger VIEW Micro-Metrology models. With travel of 300 x 150 x 150 mm, the Benchmark can accommodate a wide range of part sizes, and is rugged enough to be located in either a Q/A lab or an inspection station on the production floor.
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Compact Design Measurement System
Benchmark 450
The Benchmark's fixed bridge design separates the X and Y axis motions, allowing each to operate without any influence on the other. This arrangement provides the maximum mechanical integrity and accuracy in the stage motion. The bridge type design also makes loading and unloading of large parts more efficient, and helps to minimize the overall footprint of the system.
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Dimensional Metrology System
PINNACLE PLUS
Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
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Dimensional Metrology System
SUMMIT
The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
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Dimensional Measurement System
MICROLINE AF
The VIEW MicroLine® is a high-performance critical dimensional measurement system for wafers, masks, MEMS and other micro-fabricated devices in situations which do not require fully automated operation.
