Thermal Conductivity Measuring Device

TCM1001 - Rhesca Co., Ltd.

In recent years, there has been a demand for small and thin electronic products such as mobile devices, and printed circuit boards are shifting to thin, multi-layered, and even modularized printed circuit boards. effect of bonding materials, that is, the ability to easily conduct heat, is emphasized, and testing equipment that evaluates thermal conductivity is required .As a business of our company, we have mainly manufactured and sold test equipment for solder wettability tests and solder bonding strength, but there was a need to urgently develop next-generation bonding material test equipment to replace these. Under these circumstances, we received a request from an academic research facility to manufacture a device that can measure the thermal conductivity of conductive adhesives under research and development, and we were able to obtain an opportunity to develop the device. We proceeded with the development based on these requirements .