Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT - Dantec Dynamics A/S (Dantec Dynamics)
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
