Wetting Tester

Wetting Tester

The Malcom SP-2 Wetting Tester helps to test the wettability of solder paste and components while actually simulating the SMT mounting and reflow process. The SP-2 simulates the actual temperature that solder paste undergoes during preheat and reflow, letting you easily identify any deficiencies in flux activity or components wettability. Measurement of the solder paste wettability, components wettability, printed board wettability, wettability on temperature rise, and wettability on preheating time. By actual simulation of the SMT mounting and reflow process with standard variable, it is possible to develope an accurate, repeatable evaluation method to determine a solder paste's solderability.

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