Solder Impurity Tester

STA-2 - Seika Machinery Inc.

Reflow soldering quality with solder paste can be maintained by controlling the furnace temperature or determining the temperature profile on condition that the solder paste material is decided and the materials, surface treatment, or surface conditions during storage of parts and PCB patterns are kept clean. In the case of dip soldering, on the other hand, work is sequentially flown into molten solder, so that copper as a PCB pattern material and palladium, silver lead, and other various components employed for the surface treatment of part leads melt into solder to cause the solder composition to change.