Extremely Modular Handling,Mark, Scan & Pack System

Extremely Modular Handling,Mark, Scan & Pack System

Extremely Modular Handling, Mark, Scan & Pack System. * Handling, Inspection, Packing System * Throughput up to 16,000 ICs/hour * Index time < 0.45 s * Conversion kits for all SO and QFN devices down to 1.5 mm, incl. QFN thin * Full split kit capability * Ambient/hot/tri-temp -60C ... +175C * Large variety of contactors: Kelvin, RF, Pogo, ECT, Johnstech, Yamaichi, C-Type * MEMS applications for magnetic, optical, pressure and acoustic sensors

Get Help