Semi-automatic Semiconductor Probe Assembly Equipment
The components of the incoming parts are pre-assembled and preloaded to two packages. We use a high-speed four-axis robot equipped with high-precision multi-sensor grips to grab these pre-assembled subcomponents. Under CCD visual guidance, a set of rotary grab devices is equipped to capture top plunger. The device uses a multi-set CCD visual module to ensure accuracy, and the positioning accuracy of each motion link is controlled within 15um.
