Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Scanning Acoustic Microscope
Echo
The ECHO scanning acoustic microscope is a nondestructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in the lab or on the production floor.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Ultrasonic Transducers
Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
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Software Options
Sonix offers powerful wafer software tools to enhance bonded wafer imaging, accelerate production and adapt AutoWafer and AutoWafer Pro to our customers’ specific requirements.
