Front and Back Side Topography Defect Detection

Front and Back Side Topography Defect Detection

High throughput
Nanometer range vertical sensitivity
Simultaneous double side inspection
Nanotopography and Topography measurement
Detection of Slip lines, particles, Hairline cracks, SOI voids, Comets, EPI defects…
Compliant with thin or thick wafers, taiko wafers, highly warped wafers

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