Single-Inline Package (SIP) Relays
Series LS - Teledyne Relays
Series LS single-inline package (SIP) relays are designed for mounting on printed circuit boards. LS relays facilitate heat sinking by providing an metallic interface surface. The relays use a direct-bonded copper substrate for thermal efficiency, thermal stress performance and long-life expectancy. Optional heat sinks are available.
Available options include:
LS24D16C 50A, 90-280Vac, 600Vpeak Load; 4-20mA Control
SHP24N50R 50A, 100-280Vac, 600Vpeak Load; 8-30Vdc Control
