Test And Product Engineering Services
Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.