CMP
Tokyo Seimitsu Co., Ltd. (Accretech)
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
Tokyo Seimitsu Co., Ltd. (Accretech)
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
