Bonding Tester

In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.

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Topics

Testers
Solder Ball
Solder Joint
Loads
Wire
Measurement
Gold
Detection
Electrodes
Positioning