Edge AI Platforms
ADLINK Technology Inc. (ADLINK)
ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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AI-enabled Embedded NVR Powered by NVIDIA® Jetson Xavier™ NX
DLAP-301-JNX
NVIDIA® Jetson Xavier™ NX processing/inference engine*6-core NVIDIA Carmel ARM® v8.2 64-bit CPU*384-core NVIDIA Volta™ GPU with 48 Tensor Cores*8x PoE for IP cameras*HDMI, 8-bit digital inputs/outputs, 2x COM, 3x USB, 1x GbE for uplink
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Jetson Xavier™ NX Edge Inference Platform
DLAP-211-JNX
*Deep learning acceleration with Jetson Xavier™ NX*Compact fanless system 148(W)x120(D)x49.1(H)mm*Wide temperature range from -20°C to 70°C
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NVIDIA® Jetson™ TX2 Edge Inference Platform
DLAP-201-JT2
*Deep learning acceleration with NVIDIA® Jetson™ TX2*Compact fanless system 148(W)x105(D)x50(H)mm*Wide temperature range from -20°C to 70°C
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AI-enabled Embedded NVR Powered by NVIDIA® Jetson Nano™
DLAP-301-Nano
*NVIDIA® Jetson Nano™ processing/inference engine*Quad-core ARM® Cortex®-A57 MPCore processor*128 NVIDIA CUDA® cores*8x PoE for IP cameras*HDMI, 8-bit digital inputs/outputs, 2x USB, 1x GbE for uplink
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NVIDIA® Jetson Nano™ Edge Inference Platform
DLAP-211-Nano
*Deep learning acceleration with NVIDIA® Jetson Nano™*Compact fanless system 148(W)x120(D)x49.1(H)mm*Wide temperature range from -20°C to 70°C
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2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6110
- 1x Intel® Xeon® D-2100 family processor- 4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT support- TPM 1.2/2.0 modul- 2x IEEE 1588 v2 1PPS/TOD RJ-45 port and 4x 1PPS SMA input/output Specifications- Verified for Intel® Select Solution for uCPE on CentOS
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2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6110
- 1x Intel® Xeon® D-2100 family processor- 4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT support- TPM 1.2/2.0 modul- 2x IEEE 1588 v2 1PPS/TOD RJ-45 port and 4x 1PPS SMA input/output Specifications- Verified for Intel® Select Solution for uCPE on CentOS
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Jetson Xavier™ NX Edge Inference Platform
DLAP-211-JNX
*Deep learning acceleration with Jetson Xavier™ NX*Compact fanless system 148(W)x120(D)x49.1(H)mm*Wide temperature range from -20°C to 70°C
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AI-enabled Embedded NVR Powered by NVIDIA® Jetson Xavier™ NX
DLAP-301-JNX
NVIDIA® Jetson Xavier™ NX processing/inference engine*6-core NVIDIA Carmel ARM® v8.2 64-bit CPU*384-core NVIDIA Volta™ GPU with 48 Tensor Cores*8x PoE for IP cameras*HDMI, 8-bit digital inputs/outputs, 2x COM, 3x USB, 1x GbE for uplink
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NVIDIA® Jetson Nano™ Edge Inference Platform
DLAP-211-Nano
*Deep learning acceleration with NVIDIA® Jetson Nano™*Compact fanless system 148(W)x120(D)x49.1(H)mm*Wide temperature range from -20°C to 70°C
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AI-enabled Embedded NVR Powered by NVIDIA® Jetson Nano™
DLAP-301-Nano
*NVIDIA® Jetson Nano™ processing/inference engine*Quad-core ARM® Cortex®-A57 MPCore processor*128 NVIDIA CUDA® cores*8x PoE for IP cameras*HDMI, 8-bit digital inputs/outputs, 2x USB, 1x GbE for uplink
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Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™
DLAP-401-Xavier
- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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Embedded Robotic Controller Powered by NVIDIA® Jetson AGX Xavier™ Module
ROScube-X
ROScube-X, a ROS 2 enabled robotic controller powered by the NVIDIA® Jetson AGX Xavier module, features an integrated NVIDIA Volta GPU and dual deep learning accelerators and a wide variety of interfaces including GMSL2 camera connectors for advanced robotic system integration. ROScube-X supports the full complement of resources developed with the NVIDIA JetPack SDK and ADLINK’s Neuron SDK, and is specifically suited for robotic applications demanding high-AI computing with minimal power consumption.
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NVIDIA® Jetson™ TX2 Edge Inference Platform
DLAP-201-JT2
*Deep learning acceleration with NVIDIA® Jetson™ TX2*Compact fanless system 148(W)x105(D)x50(H)mm*Wide temperature range from -20°C to 70°C
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Rugged, Fanless AIoT Platform with NVIDIA Quadro® GPU Embedded for Real-time Video/Graphics Analytics
AVA-5500 Series
Artificial Intelligence (AI) technologies are being adopted globally by all industries to drive efficiency, improve productivity and reduce costs. The rail industry is no exception. Fueled by intelligence from AI-driven systems and applications, railway operations are becoming safer, smarter and more reliable, significantly enhancing passenger travel experience and freight logistics services. For rail transportation, AI can provide improvements including fast and convenient ticket-free check-in to accurate arrival-time predictions, personalized infotainment and onboard services, real-time track heath diagnostics, and rapid response in an emergency.
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3100-CF Series
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM) and 5x Intel® i210-AT
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
