Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series - ADLINK Technology Inc. (ADLINK)
- ADLINK MXM Graphics module support (Type A/B, up to 120W)
- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)
- DisplayPort (2 from CPU, 4 from MXM)
- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
- Reliable Molex type 12V DC-in connector
- 1x Intel® i219-LM and 3x Intel® i210-AT
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Expandable Fanless Embedded Computers
ADLINK's MXC product line provides fanless embedded computers for high-performance embedded solutions. Leading the field, high-performance computing power combines with PCI/PCIe high-speed expansion slots in a compact enclosure fully enabling integration of a variety of applications.
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Edge AI Platforms
ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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IPC Systems
Industrial Server-Grade System delivers a scalable high performance platform for a wide array of industrial applications.
