Expandable Fanless Embedded Computers
ADLINK Technology Inc. (ADLINK)
ADLINK's MXC product line provides fanless embedded computers for high-performance embedded solutions. Leading the field, high-performance computing power combines with PCI/PCIe high-speed expansion slots in a compact enclosure fully enabling integration of a variety of applications.
- Industrial PCs, Fanless Embedded PCs
- Expandable Fanless Embedded Computers
- Integrated Fanless Embedded Computers
- IPC Systems
- IoT Gateway
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
*9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor*Dual SODIMMs for up to 32GB DDR4*Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0*2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0*Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
*9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor*Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC*Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0*2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0*Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
*9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor*Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory*Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0*2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0*Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6010/6020 Series
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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Intel® Wireless-AC 9260 Wi-Fi + Bluetooth M.2 2230 Module Card with Cables and Antenna Kit
EWK-M2-AC9260 Series
Intel® Wireless-AC 9260 Wi-Fi + Bluetooth M.2 2230 module card with cables and antenna kit
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Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
*9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor*Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC*Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0*2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0*Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
*9th Gen Intel® Core™ i7/i5/i3 LGA processor*Dual SODIMMs sockets for up to 32GB DDR4*Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0*3x USB 3.1 Gen 1, 3x USB 2.0*Rich storage options: 2x 2.5" SATA, M.2 2280
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3100-CF Series
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM) and 5x Intel® i210-AT
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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High-Performance AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-iX000-P Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Fully Modular Slot-In Platform with Backplane Architecture Supporting up to 8 Independent 4K/UHD Displays
ADi-SC1X
- Flexible platform selection: 6th Gen. and later Intel® Core™ CPU and AMD Ryzen™ APU with COMe support- Flexible maintenance and upgrade: slot-in/backplane design, - CPU COMe module, GPU MXM module- Full-scale customization options: GDDR5, V-BIOS, video ports, I/O ports, etc.- High level of integration: FPGA & logging controller onboard
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Rugged, Fanless AIoT Platform with NVIDIA Quadro® GPU Embedded for Real-time Video/Graphics Analytics
AVA-5500 Series
Artificial Intelligence (AI) technologies are being adopted globally by all industries to drive efficiency, improve productivity and reduce costs. The rail industry is no exception. Fueled by intelligence from AI-driven systems and applications, railway operations are becoming safer, smarter and more reliable, significantly enhancing passenger travel experience and freight logistics services. For rail transportation, AI can provide improvements including fast and convenient ticket-free check-in to accurate arrival-time predictions, personalized infotainment and onboard services, real-time track heath diagnostics, and rapid response in an emergency.
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Extreme Rugged Cold Plate Mount System with Intel® Xeon® Processor and MIL-DTL-38999 Connectors
HPERC-KBL-MC
Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel® Xeon® processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.
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Rugged Convection Cooled System with Intel® Xeon® Processor and MIL-DTL-38999 Connectors
HPERC-KBL-MH
Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel® Xeon® processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.
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6U CompactPCI Rear Transition Module with AMD MXM Graphics Module
cPCI-R6500 Series
The cPCI-R6500 Series is 6U CompactPCI rear transition module (RTM) designed for use with ADLINK 6U CompactPCI CPU blades. The cPCI-R6500 is an RTM equipped with an ATI graphics module to provide additional graphics performance for embedded applications and supports comprehensive rear I/O functionality. Dual independent display output is via two DVI ports and an onboard Realtek ALC262 High Definition Audio Codec provides analog audio output from the audio controller on the CPU blade. The cPCI-R6500 requires a compatible 6U CompactPCI backplane with rear I/O support and correctly configured CPU blade.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
*9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor*Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory*Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0*2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0*Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6010/6020 Series
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
*9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor*Dual SODIMMs for up to 32GB DDR4*Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0*2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0*Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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Industrial PCs, Fanless Embedded PCs
The Matrix series of fanless embedded computers enhances responsiveness and durability of edge AI and edge computing applications. Designed to perform and to last, the Matrix fanless embedded computers enable timely data-driven decision making at the edge, improving efficiency, productivity and security enhancement across industries.
