Bond Tester for Wafers 2 - 12 inch

Sigma W12 - Xyztec

Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)
Precise testing and Cold Bump Pull (CBP) testing
Large X/Y stages X: 600mm, Y: 370 mm
Force range from 1gf – 10 kgf
Bump pitch down to 20 µm