![Copper Diffusion TestSystems](https://d27wgn5g4t3wja.cloudfront.net/img/f6dfc5b2-b5d0-41f4-9bb8-7fa76c6379b6/317838.png)
Copper Diffusion TestSystems
Materials Development Corporation (MDC)
MDC announces the addition of software and hardware for copper diffusion studies to its CSM/Win suite of semiconductor test systems and software. This new CSM/Win feature plays an important part in the development of processes and materials for the next advance in integrated circuit technology that employs
copper as a conductor. Special Current-Voltage Bias-Temperature Stress (IV-BTS) software can measure the degradation of insulator quality due to copper diffusion.
Multiple test sites can be stressed with a constant voltage while the current through each site is measured and recorded. The Current-Voltage Bias-Temperature Stress test supplements conventional MOS C-V measurements and Triangular Voltage Measurements (TVS) that are also employed in copper diffusion studies.