3U VPX
Advantech 3U VPX CPU blades are OpenVPX-complaint and provide high speed, low latency, and scalable interconnectivity with flexible developer tools.
- CPCI & VPX
- 3U VPX
- 6U CompactPCI
- 6U VPX
- 3U CompactPCI
- 3U CompactPCI-Serial
- CompactPCI Enclosures
- Other Peripherals
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product
3U OpenVPX XMC carrier
MIC-6131
MIC-6131 is a 3U OpenVPX XMC carrier. MIC-6131 complies with the MOD3-PER-1F-16.3.2-3 profile, and the VITA 46.0, 46.4, 46.9 and VITA 48 specification. The MIC-6131 Data Plane has the PCIe Gen 3. Input, up to x8 lanes, and provides the optional PCIe gen. 3 output with another x8 lanes. With this design, MIC-6131 is able to support the most powerful XMC with the 75W power consumption*, and doesn’t sacrifice the full fabric bandwidth from the main board. For the XMC pin out, MIC-6131 has the X24S X8D X12D pin field on the VPX connector P2, and enables the vast capability of customization of the customer.
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product
3U OpenVPX PCIe/ SATA M.2 carrier
MIC-6130
MIC-6130 is a 3U OpenVPX M.2 carrier. MIC-6110 complies with the MOD3-PER-1F-16.3.2-3 profile, and the newest PCI Express M.2 Specification Revision 1.1. Advantech provides MIC-6130 with either the PCIE Gen.3 interface or SATA III interface, and various physical device sizes for the different usages.
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product
3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family
MIC-6330
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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product
3U OpenVPX XMC carrier
MIC-6131
MIC-6131 is a 3U OpenVPX XMC carrier. MIC-6131 complies with the MOD3-PER-1F-16.3.2-3 profile, and the VITA 46.0, 46.4, 46.9 and VITA 48 specification. The MIC-6131 Data Plane has the PCIe Gen 3. Input, up to x8 lanes, and provides the optional PCIe gen. 3 output with another x8 lanes. With this design, MIC-6131 is able to support the most powerful XMC with the 75W power consumption*, and doesn’t sacrifice the full fabric bandwidth from the main board. For the XMC pin out, MIC-6131 has the X24S X8D X12D pin field on the VPX connector P2, and enables the vast capability of customization of the customer.
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product
3U OpenVPX PCIe/ SATA M.2 carrier
MIC-6130
MIC-6130 is a 3U OpenVPX M.2 carrier. MIC-6110 complies with the MOD3-PER-1F-16.3.2-3 profile, and the newest PCI Express M.2 Specification Revision 1.1. Advantech provides MIC-6130 with either the PCIE Gen.3 interface or SATA III interface, and various physical device sizes for the different usages.
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product
3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family
MIC-6330
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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product
CPCI & VPX
Advantech is a key provider in the CompactPCI and VPX market for mission critical applications in the railway, semiconductor, and healthcare markets.
