RF Front-end

STMicroelectronics

The RF integrated passive device (RF IPD) uses a high-resistivity substrate to integrate quality factor components such as capacitors and indictors. Many functions like impedance matching networks, harmonic filters, couplers, baluns, and power combiners/splitters can be designed using IPD technology. ST's IPDs are manufactured using thick film and HiRes Si or glass wafer manufacturing technology and photolithography processing.