Showing results: 2956 - 2970 of 3033 items found.
-
eBOX660-872-FL -
Axiomtek Co., Ltd.
A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
-
Teledyne Defense Electronics
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
-
782856-02 -
NI
PXIe, ±60 V, ±3 A DC, ±10 A Pulsed, 20 W DC, 100 fA Precision System PXI Source Measure Unit - The PXIe-4139 is a high-precision, system source measure unit (SMU) that features 4-quadrant operation and sources up to 20 W of DC power. This module features analog-to-digital … converters that help you perform high-precision measurements with a current resolution of 100 fA or high-speed acquisitions up to 1.8 MS/s. The module can maximize stability and measurement accuracy with SourceAdapt technology, which you can use to tune the transient response to match the characteristics of any load. You can use the PXIe-4139 for applications including manufacturing test, board-level test, and lab characterization with devices such as ICs, power management ICs (PMICs), and RFICs and discrete devices including LEDs and optical transceivers.
-
782856-03 -
NI
PXIe, ±60 V, ±3 A DC, ±10 A Pulsed, 40 W DC, 100 fA Precision System PXI Source Measure Unit - The PXIe-4139 is a high-precision, system source measure unit (SMU) that features 4-quadrant operation and sources up to 40 W of DC power. This module features analog-to-digital converters that help you perform high-precision measurements with a current resolution of 100 fA or high-speed acquisitions up to 1.8 MS/s. The module can maximize stability and measurement accuracy with SourceAdapt technology, which you can use to tune the transient response to match the characteristics of any load. You can use the PXIe-4139 for applications including manufacturing test, board-level test, and lab characterization with devices such as ICs, power management ICs (PMICs), and RFICs and discrete devices including LEDs and optical transceivers.
-
782856-01 -
NI
±60 V, 3 A System PXI Source Measure Unit—The PXIe‑4138 system source measure unit (SMU) delivers high power, precision, and speed. It is ideal for a broad range of applications including manufacturing test; board-level test; lab characterization with devices such as integrated circuits (ICs), power management integrated circuits (PMICs), and radio frequency integrated circuits (RFICs); and discrete devices including LEDs and optical transceivers. The PXIe‑4138 features 4-quadrant operation. The PXIe‑4138 is a hardware-timed instrument with a high-speed sequencing engine for synchronizing acquisitions between multiple SMUs. The module supports direct DMA streaming between the host PC and SMU, so you can stream large waveforms and measurement data at the full update rate and sample rate of the instrument.
-
783760-01 -
NI
±200 V, 1 A System PXI Source Measure Unit—The PXIe‑4136 system source measure unit (SMU) delivers high power, precision, and speed. It is ideal for a broad range of applications including manufacturing test; board-level test; lab characterization with devices such as integrated circuits (ICs), power management integrated circuits (PMICs), and radio frequency integrated circuits (RFICs); and discrete devices including LEDs and optical transceivers. The PXIe‑4136 features 4-quadrant operation. The PXIe‑4136 is a hardware-timed instrument with a high-speed sequencing engine for synchronizing acquisitions between multiple SMUs. The module supports direct DMA streaming between the host PC and SMU, so you can stream large waveforms and measurement data at the full update rate and sample rate of the instrument.
-
Model 6350 -
Pentek, Inc.
- Now available in RFSoC Gen 3 with the Model 6353- Small form factor rugged enclosure- Conduction-cooled- Designed to the IP67 specification for dust and water immersion- Sealed military-grade circular connectors- Incorporates Xilinx® Zynq® UltraScale+" RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- Optional dual 100 GigE UDP optical interface- Optional fan cooling for benchtop use- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
-
Model 5586 -
Pentek, Inc.
- Jade 5585 and 5586 FAQ- Co-processor for distributed FPGA processing tasks- High-Bandwidth Memory (HBM) delivers 20x more memory bandwidth than traditional DDR4 solutions- Board interfaces: 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX proessing powerhouse- Features Xilinx Virtex UltraScale+ HBM FPGAs- 10 GigE Interface and 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled- Navigation Design Suite for software and custom IP development
-
Model 5973-312 -
Pentek, Inc.
- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe- Four 250 MHz 16-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- Optional optical Interface for backplane gigabit serial interboard communication- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Also available as Model 7070-312- See comparable JadeFX Xilinx Kintex UltraScale FPGA Family:Model 5983 JadeFX Kintex UltraScale Processor and FMC Carrier - 3U VPX
-
Talon RTR 2755 -
Pentek, Inc.
- Designed to operate under conditions of shock and vibration- Records gigabit, 10-gigabit or 40-gigabit Ethernet streams- Removable shock- and vibration-resistant SSDs perform well in vehicles, ships and aircraft- TCP and UDP protocols- Copper or optical interfaces- Aggregate recording rates to 4.0 GB/sec- 4U short 19-inch rugged rackmount PC server chassis- Windows® Server 2016 workstation with high-performance Intel® Core™ i7 processor- Up to 122 terabytes of storage to NTFS RAID solid state disk array- Multiple RAID levels of 0, 1, 5, and 6- SystemFlow® GUI with Signal Viewer analysis tool- C-callable API for integration of recorder into applications- File headers include time stamping and recording parameters- Optional GPS time and position stamping- Optional 1836 VDC power supply
-
Model 5983-324 -
Pentek, Inc.
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex UltraScale FPGAs- Four 500 MHz 16-bit A/Ds- Four digital upconverters- Four 2 GHz 16-bit D/As (500 MHz input sample rate, 2 GHz output sample rate with interpolation- 4 and 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system referencePCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- Optional optical interface for backplane gigabit serial interboard communication- LVDS connections to the Kintex UltraScale FPGA for custom I/O and sychronization- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)
-
Part No. E3P2G -
Teledyne Defense Electronics Relays & Coax Switch
The E3P2G series, three-phase solid state relay is the 2nd generation of the discontinued E3P series. The new design incorporates a high efficiency back-to-back thyristor with direct copper bonding for a longer lifetime expectancy. Over-Voltage protection is provided internally with TVS diodes for the input and output. Additionally our -16 model is designed with an RC snubber and VDR for greater protection to the output to handle all types of loads. The industrial SSR utilizes optical isolation to protect the control from load transients for each phase and has tight zero-cross window for low EMI. A control status LED are standard on all models.Available options include:E3P48D25 Load: 25A, 24-600Vrms ; Control: 4-30Vdc E3P48D50 Load: 50A, 24-600Vrms ; Control: 4-30Vdc E3P48D75 Load: 75A, 24-600Vrms ; Control: 4-30Vdc E3P48D75-16 Load: 75A, 24-520Vrms ; Control: 4-30Vdc ;E3P48D75-16 RC+VDR Output Protection
-
ficonTEC Service GmbH
Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts. The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.
-
Anderson Materials Evaluation, Inc.
Our numerous analytical techniques, we tackle a wide range of materials challenges and commonly combines several analytical techniques to fully address complex and multi-dimensional materials issues. Our materials analysis laboratory provides XPS surface analysis, thermal analysis (TGA, DSC, TMA), FTIR infrared spectroscopy, UV-Vis spectrophotometry and reflectivity measurements, gas chromatography – mass spectroscopy (GC-MS), SEM/EDX, optical microscopy, mechanical testing, electrochemistry and corrosion analyses, residual gas mass spectroscopy, contact angle measurements, surface contamination measurements, adhesive bonding failure analysis, facility testing for silicone contamination, mechanical testing, metallography and fractography, density and porosity measurements, volatile organic component testing, friction, and other analytical capabilities. We continue to upgrade and expand our arsenal of analytical techniques and custom analytical methods to support our customers’ needs.
-
CEM881 -
Axiomtek Co., Ltd.
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
