Showing results: 211 - 225 of 576 items found.
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Air quality 4 click -
MikroElektronika D.O.O.
Air quality 4 click is an advanced air quality sensing device that combines multiple metal-oxide sensing elements on a chip to provide detailed information of the air quality parameters. This click can output a TVOC value readings as well as the CO2 equivalent concentration readings in an indoor environment.
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TTV -
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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AOI -
ficonTEC Service GmbH
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Chip Antenna, SAM-M8Q (Qwiic) -
SparkFun Electronics
The SparkFun SAM-M8Q GPS Breakout is a high quality GPS board with equally impressive configuration options. The SAM-M8Q is a 72-channel GNSS receiver, meaning it can receive signals from the GPS, GLONASS, and Galileo constellations. This increases precision and decreases lock time and thanks to the onboard rechargable battery, you'll have backup power enabling the GPS to get a hot lock within seconds! Additionally, this u-blox receiver supports I2C (u-blox calls this Display Data Channel) which made it perfect for the Qwiic compatibility so we don't have to use up our precious UART ports. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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Walts Co., Ltd
Advanced Dummy Test Wafers/Chips available with over 35 different chip designs and choices of 11 different material configurations as well as kits complete with test vehicles. Custom-make test production of TEG wafer/glass (TEG=Test Element Group). Design and provide custom-make test kit.
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Veloce -
Mentor Graphics Corp.
The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Renesas Electronics Corp.
Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Renesas Electronics Corp.
Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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SX-SDPGN -
Silex Technology
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Xeltek
SuperBOT is an automatic IC programmer with high performance and reasonable price for large-scale electronic product manufacturing. This programmer can automatically pick up, place, program, take out and pack up chips. SuperBOT 3 is capable of supporting most MCU, CPLD, serial and parallel NOR/NAND FLASH.
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POWERQUICC® -
Teledyne e2v
The PowerQUICC® II and III family are based on the scalable 603e and e500 system-on-chip (SoC) platforms and Power ArchitectureTM processor cores.- PowerQUICC® II | 200- 450 MHz | 603e Core Architecture- PowerQUICC® III | 800MHz-1.5GHz | Single & Dual e500 Core
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Cadence Design Systems
Using the Cadence Verification Suite, you can reduce system integration time by up to 50%, accelerating intellectual property (IP) development, system-on-chip (SoC) integration, and concurrent hardware/software development. This verification suite is comprised of core engines, verification fabric technologies, and solutions spanning these technologies.
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ROM-7420 -
Advantech Co. Ltd.
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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VX1290N-2eSST -
CAEN S.p.A.
The VX1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs.
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V1290N-2eSST -
CAEN S.p.A.
The V1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs..